Side hole Packaged -Shell Encapsulated etched FBG Hydrophone

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@article{b29fe7a2f2e64f68963e4cd1f135c6e4,

title = "Side hole Packaged -Shell Encapsulated etched FBG Hydrophone",

author = "V.R. Anand and Ramanan, \{S. Raja\} and T. Santhanakrishnan and S. Asokan",

year = "2023",

doi = "10.1109/jsen.2023.3308378",

language = "Undefined/Unknown",

journal = "IEEE Sensors Journal",

issn = "1530-437X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Side hole Packaged -Shell Encapsulated etched FBG Hydrophone

AU - Anand, V.R.

AU - Ramanan, S. Raja

AU - Santhanakrishnan, T.

AU - Asokan, S.

PY - 2023

Y1 - 2023

UR - http://dx.doi.org/10.1109/jsen.2023.3308378

U2 - 10.1109/jsen.2023.3308378

DO - 10.1109/jsen.2023.3308378

M3 - Article

SN - 1530-437X

JO - IEEE Sensors Journal

JF - IEEE Sensors Journal

ER -