X-ray diffraction imaging metrology of warpage in silicon die: image processing and data analysis

This study presents a method for reconstructing die warpage and surface displacement in silicon chips by combining XRDI section topography data acquired at multiple orthogonal orientations using synchrotron radiation. MasqueTron is a custom-developed software adapted for the efficient extraction of quantitative data points from synchrotron section topographs. The software is capable of processing thousands of section topography images acquired from single dies as well as multi-stack dies embedded within packaged chips. The extracted data points are subsequently used as inputs for MATLAB-based numerical routines to calculate angular deviations (Δω) and to reconstruct three-dimensional die warpage maps. To enhance the accuracy and reliability of the reconstructed warpage profiles, warpage angles derived from rocking-curve measurements at azimuthal orientations φ = 0°, 90°, 180°, and 270° were recorded at the synchrotron, generating large image datasets. All acquired images were converted into binary data sets using MasqueTron, and these processed data were then employed within the developed analytical framework and MATLAB code to map the die warpage with high spatial fidelity.