@inproceedings{31df4d6e22aa4aac98b47afaee4ef2b7,
title = "The Link between Spatial Skills and Engineering Problem-Solving",
abstract = "Well-developed 3-D spatial skills are correlated with engineering success. However, most studies examining the link between spatial skills and engineering success have been conducted at the macro level, i.e., the link between spatial skills and course grades or between spatial skills and graduation rates. In this research, a more refined approach has been taken. Relationships between spatial skills and success in solving certain types of problems that engineering students commonly encounter are examined. It was found that high levels of spatial skills predict success in solving certain types of engineering problems but not in all types of problems. Data gathered through this research will be further analyzed to determine characteristics of problems where spatial skills appear to play a role and characteristics where they do not.",
keywords = "engineering student success, problem-solving, spatial skills",
author = "Gavin Duffy and Sheryl Sorby and Reves, \{Presentacion Rivera\} and Tom Delahunty and Lance Perez and Javashri Ravishankar",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018 ; Conference date: 04-12-2018 Through 07-12-2018",
year = "2018",
month = jul,
day = "2",
doi = "10.1109/TALE.2018.8615193",
language = "English",
series = "Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "272--278",
editor = "Lee, \{Mark J.W.\} and Sasha Nikolic and Montserrat Ros and Jun Shen and Lei, \{Leon C. U.\} and Wong, \{Gary K.W.\} and Neelakantam Venkatarayalu",
booktitle = "Proceedings of 2018 IEEE International Conference on Teaching, Assessment, and Learning for Engineering, TALE 2018",
address = "United States",
}