Packaged chalcogenide microsphere resonator with high Q-factor

Pengfei Wang; Ming Ding; Timothy Lee; Ganapathy Senthil Murugan; Lin Bo; Yuliya Semenova; Qiang Wu; Dan Hewak; Gilberto Brambilla; Gerald Farrell

doi:10.1063/1.4801474

Packaged chalcogenide microsphere resonator with high Q-factor

Pengfei Wang, Ming Ding, Timothy Lee, Ganapathy Senthil Murugan, Lin Bo, Yuliya Semenova, Qiang Wu, Dan Hewak, Gilberto Brambilla, Gerald Farrell

School of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

57 Citations (Scopus)

Abstract

The fabrication and characterization of a packaged As₂S ₃ microsphere resonator coupled to a tapered fiber using a low refractive index UV-curable polymer are reported. Embedding provides an efficient means to remove the highest order whispering gallery modes in the microsphere resonator, thus cleaning the resonator spectrum. At wavelengths near 1549.5 nm, high-Q modes up to 1.8 × 10⁵ can be efficiently excited in a 110 μm diameter chalcogenide microsphere via evanescent coupling from a 2 μm diameter tapered silica fiber. The device photosensitivity, useful for tuning, is still present and useable after the packaging process.

Original language	English
Article number	131110
Journal	Applied Physics Letters
Volume	102
Issue number	13
DOIs	https://doi.org/10.1063/1.4801474
Publication status	Published - 1 Apr 2013

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title = "Packaged chalcogenide microsphere resonator with high Q-factor",

abstract = "The fabrication and characterization of a packaged As2S 3 microsphere resonator coupled to a tapered fiber using a low refractive index UV-curable polymer are reported. Embedding provides an efficient means to remove the highest order whispering gallery modes in the microsphere resonator, thus cleaning the resonator spectrum. At wavelengths near 1549.5 nm, high-Q modes up to 1.8 × 105 can be efficiently excited in a 110 μm diameter chalcogenide microsphere via evanescent coupling from a 2 μm diameter tapered silica fiber. The device photosensitivity, useful for tuning, is still present and useable after the packaging process.",

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AU - Wang, Pengfei

AU - Ding, Ming

AU - Lee, Timothy

AU - Senthil Murugan, Ganapathy

AU - Bo, Lin

AU - Semenova, Yuliya

AU - Wu, Qiang

AU - Hewak, Dan

AU - Brambilla, Gilberto

AU - Farrell, Gerald

PY - 2013/4/1

Y1 - 2013/4/1

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AB - The fabrication and characterization of a packaged As2S 3 microsphere resonator coupled to a tapered fiber using a low refractive index UV-curable polymer are reported. Embedding provides an efficient means to remove the highest order whispering gallery modes in the microsphere resonator, thus cleaning the resonator spectrum. At wavelengths near 1549.5 nm, high-Q modes up to 1.8 × 105 can be efficiently excited in a 110 μm diameter chalcogenide microsphere via evanescent coupling from a 2 μm diameter tapered silica fiber. The device photosensitivity, useful for tuning, is still present and useable after the packaging process.

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VL - 102

JO - Applied Physics Letters

JF - Applied Physics Letters

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Packaged chalcogenide microsphere resonator with high Q-factor

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