TY - GEN
T1 - Hybrid-Cooled Data Center Server Layout Optimization for Air-Side Heat Recovery
AU - Sakanova, Assel
AU - Alimohammadi, Sajad
AU - McEvoy, Jaakko
AU - Persoons, Tim
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/12/27
Y1 - 2018/12/27
N2 - The rapid increase in energy demand for data center requires improved cooling techniques. This study investigates, numerically and experimentally, the energy efficiency optimization based on server level air flows and also identifies the potential for waste heat recovery from the air stream for a hybrid air/liquid cooled server. Multi-objective genetic algorithm and entropy generation minimization are chosen as tools to address the multiple objectives involved in the problem and examine the cooling performance and waste heat recovery potential. Selected experimental measurements have successfully validated the CFD simulation model.
AB - The rapid increase in energy demand for data center requires improved cooling techniques. This study investigates, numerically and experimentally, the energy efficiency optimization based on server level air flows and also identifies the potential for waste heat recovery from the air stream for a hybrid air/liquid cooled server. Multi-objective genetic algorithm and entropy generation minimization are chosen as tools to address the multiple objectives involved in the problem and examine the cooling performance and waste heat recovery potential. Selected experimental measurements have successfully validated the CFD simulation model.
UR - http://www.scopus.com/inward/record.url?scp=85061481140&partnerID=8YFLogxK
U2 - 10.1109/THERMINIC.2018.8593309
DO - 10.1109/THERMINIC.2018.8593309
M3 - Conference contribution
AN - SCOPUS:85061481140
T3 - THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
BT - THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2018
Y2 - 26 September 2018 through 28 September 2018
ER -