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Finite element analysis of interfacial debonding in copper/diamond composites for thermal management applications

  • M. Zain-ul-Abdein
  • , H. Ijaz
  • , W. Saleem
  • , K. Raza
  • , A.S.B. Mahfouz
  • , T. Mabrouki

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Article number739
JournalMaterials
Volume10
Issue number7
DOIs
Publication statusPublished - 2017

Keywords

  • Copper/diamond composite
  • Cr-coated diamond
  • Finite element analysis
  • Interfacial debonding
  • Thermal cyclic load

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