Experimental Characterization and Numerical Simulation of Liquid Flow and Heat Transfer Through Offset Strip Fins

Saeel S. Pai; Eoin H. Oude Essink; Abhijeet Banthiya; Liang Pan; Justin A. Weibel

doi:10.1109/ITherm55376.2025.11235699

Experimental Characterization and Numerical Simulation of Liquid Flow and Heat Transfer Through Offset Strip Fins

Saeel S. Pai
, Eoin H. Oude Essink
, Abhijeet Banthiya
, Liang Pan
, Justin A. Weibel

Technological University Dublin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Original language	English
Title of host publication	2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Pages	1-9
Number of pages	9
DOIs	https://doi.org/10.1109/ITherm55376.2025.11235699
Publication status	Published - 2025

Keywords

Strips
Fluids
Correlation
Thermal factors
Friction
Thermal resistance
Numerical simulation
Numerical models
Electrical resistance measurement
Heat transfer
liquid cooling
offset strip fins
friction factor
Nusselt number
Colburn j-factor

Access to Document

10.1109/ITherm55376.2025.11235699

Cite this

@inproceedings{3ec00084c94647689a8f9c5bf62673f1,

title = "Experimental Characterization and Numerical Simulation of Liquid Flow and Heat Transfer Through Offset Strip Fins",

keywords = "Strips, Fluids, Correlation, Thermal factors, Friction, Thermal resistance, Numerical simulation, Numerical models, Electrical resistance measurement, Heat transfer, liquid cooling, offset strip fins, friction factor, Nusselt number, Colburn j-factor",

author = "Pai, \{Saeel S.\} and Essink, \{Eoin H. Oude\} and Abhijeet Banthiya and Liang Pan and Weibel, \{Justin A.\}",

year = "2025",

doi = "10.1109/ITherm55376.2025.11235699",

language = "English",

pages = "1--9",

booktitle = "2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)",

}

Experimental Characterization and Numerical Simulation of Liquid Flow and Heat Transfer Through Offset Strip Fins. / Pai, Saeel S.; Essink, Eoin H. Oude; Banthiya, Abhijeet et al.
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). 2025. p. 1-9.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Experimental Characterization and Numerical Simulation of Liquid Flow and Heat Transfer Through Offset Strip Fins

AU - Pai, Saeel S.

AU - Essink, Eoin H. Oude

AU - Banthiya, Abhijeet

AU - Pan, Liang

AU - Weibel, Justin A.

PY - 2025

Y1 - 2025

KW - Strips

KW - Fluids

KW - Correlation

KW - Thermal factors

KW - Friction

KW - Thermal resistance

KW - Numerical simulation

KW - Numerical models

KW - Electrical resistance measurement

KW - Heat transfer

KW - liquid cooling

KW - offset strip fins

KW - friction factor

KW - Nusselt number

KW - Colburn j-factor

U2 - 10.1109/ITherm55376.2025.11235699

DO - 10.1109/ITherm55376.2025.11235699

M3 - Conference contribution

SP - 1

EP - 9

BT - 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

ER -