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A Novel Liquid Cooled Heat Sink with Adjacent Micro Synthetic Jets for Thermal Management in Microelectronic Devices

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper investigates the use of flow vectoring phenomena in adjacent synthetic jets for cooling hot spots in a microchannel. By applying an appropriate phase difference, fluid flow is induced within the microchannel using adjacent synthetic jets. The performance of this configuration is evaluated under conditions representative of cooling electronic packages using pure water and water- Al2 O3 nanofluids with varying concentrations and particle diameters while maintaining constant jet operating conditions. The addition of nanoparticles alters the fluid properties, resulting in two competing effects: weakened jet performance due to increased viscosity and enhanced heat transfer through improved thermal conductivity. Both effects are analysed, and the best performance is observed with water-based nanofluids, showing a 4.5% enhancement in heat transfer compared to pure water under the same operating conditions. This indicates that although the same input power is applied to both water and nanofluids, the latter exhibits a lower Rej due to changes in fluid properties but demonstrates better performance in cooling the hot spot. When the Rej is kept constant, a 21% enhancement in heat transfer is achieved for water- Al2O3 at φ= 5% and dp=30 nm compared to pure water.

Original languageEnglish
Title of host publicationProceedings of the 24th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2025
PublisherIEEE Computer Society
ISBN (Electronic)9798331524289
DOIs
Publication statusPublished - 2025
Event24th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2025 - Dallas, United States
Duration: 27 May 202530 May 2025

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
ISSN (Print)1936-3958

Conference

Conference24th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2025
Country/TerritoryUnited States
CityDallas
Period27/05/2530/05/25

Keywords

  • electronics cooling
  • heat transfer
  • microchannel
  • nanofluids
  • synthetic jet

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